Chips Ahoy! Taiwan IC Companies Win Big With Next-Gen iPhone

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A Taiwanese computer-chip manufacturer and two of its subsidiaries are reported to be suppliers of circuitry for the rumored "iPhone 3.0."

Sources claim Taiwan Semiconductor Manufacturing Company (TSMC) have landed foundry orders for GSM EDGE power amplifiers, Bluetooth ICs
and 3.2-megapixel OmniVision CMOS image sensor (CIS) used in the
upcoming iPhone model, while Xintec will handle the packaging and testing service for the CIS
and VisEra will manufacture the CIS's on-chip color filters.

TSMC, despite their Pacific Rim locale, not surprisingly greeted the reports with a Sgt. Schultz-like "I know NOTHING!  I hear NOTHING!"

[Via DigiTimes]

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